IPC-6010
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| Titel (Deutsch, Kurz) | : | |
| Titel (Deutsch, Lang) | : | |
| Titel (Englisch, Kurz) | : | IPC-6010 |
| Titel (Englisch, Lang) | : | IPC-6010 Series |
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| Veröffentlicht am | : | |
| Tritt in Kraft am | : | |
| Enhält Norm | : | IPC-6011, IPC-6012, IPC-6013, IPC-6015, IPC-6016, IPC-6018 |
| Enthalten in | : | |
| Ändert | : | |
| Ersetzt | : | |
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| Inhalt (Deutsch) | : | |
| Inhalt (Englisch) | : | The IPC-6010 series includes IPC's current qualification and performance specification standards for every type of printed circuit board. The series includes IPC-6011, the base document, which includes all generic requirements for printed boards, regardless of substrate. Along with IPC-6011, use the appropriate sectional standard: IPC-6012 Qualification and Performance Specification for Rigid Printed Boards; IPC-6013 Flexible Printed Boards; IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures; IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards; and IPC-6018 Microwave End Product Board Inspection and Test. Some enhancements over previous IPC performance documents include updated surface plating/coating criteria, new plating integrity requirements for plated-through holes, expanded coverage of solder resist, new micro-sectioned coupon requirements and specifications for hybrid/composite high frequency boards. Purchase the entire series and save 20% on the cost of individual documents. |
