IPC-6016

Fakten

`Titel (Deutsch, Kurz)`	`:`
`Titel (Deutsch, Lang)`	`:`

`Titel (Englisch, Kurz)`	`:`	`IPC-6016`
`Titel (Englisch, Lang)`	`:`	`Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards`

`Verabschiedet am`	`:`
`Veröffentlicht am`	`:`	`Mai 1999`
`Tritt in Kraft am`	`:`

`Enhält Norm`	`:`
`Enthalten in`	`:`	`IPC-6010`

`Ändert`	`:`
`Ersetzt`	`:`

`Geändert durch`	`:`
`Ersetzt durch`	`:`

`Inhalt (Deutsch)`	`:`

`Inhalt (Englisch)`	`:`	This document establishes the specific electrical, mechanical and environmental requirements for organic HDI layers with microvia technology. The acceptance criteria of the HDI layers are organized into specification sheets that reflect typical end-use applications, such as cellular phones, avionics, automotive and personal computers. Key concepts include: HDI conductive surface requirements, microvia integrity, HDI electrical properties and end use application slash sheets. For use with IPC-6011. 55 pages.