IPC-T-50G

Fakten

`Titel (Deutsch, Kurz)`	`:`
`Titel (Deutsch, Lang)`	`:`

`Titel (Englisch, Kurz)`	`:`	`IPC-T-50G`
`Titel (Englisch, Lang)`	`:`	`Terms & Definitions for Interconnecting & Packaging Electronic Circuits`

`Verabschiedet am`	`:`
`Veröffentlicht am`	`:`	`Dezember 2003`
`Tritt in Kraft am`	`:`

`Enhält Norm`	`:`
`Enthalten in`	`:`

`Ändert`	`:`
`Ersetzt`	`:`

`Geändert durch`	`:`
`Ersetzt durch`	`:`

`Inhalt (Deutsch)`	`:`

`Inhalt (Englisch)`	`:`	This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision G contains over 500 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, lead free solders, assembly processes, base materials and high speed/high frequency boards. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching. 135 pages.